The world’s leading trade fair for electronic components, systems and applications starts on 8 November 2016. Bosch will be at the same spot as in the previous years: A5.106.
Meet us here and dive with us into our broad spectrum of products, solutions, applications in automotive electronics as well as consumer electronics and Industry 4.0. All this can be experienced life and in action. There is a also highlight you should not miss...
electronica India 2016 takes place again in in the Bangalore International Exhibition Centre (BIEC) from September 21nd to 23rd, 2016. Meet our local sales and application team and let them present amazing automotive MEMS sensors and System ICs to you. We are located in Hall2, #2531.
In the funded BMBF project “intelligent laser based adaptive headlight system” (iLaS), Bosch is working on the headlights of the future with partners from industry and science. The new technology will make roadway illumination even more flexible and highly versatile – in all situations. It operates with a rapidly moving MEMS micro-mirror from Bosch, which redirects the laser beam.
Bosch annual press conference presented information around the current business as well as an outlook and activities in future business fields.
This included sensors and semiconductors for consumer and automotive electronics as well as platforms and services around IoT.
Embedded World (Messe Nuremberg, Germany, February 23-25) is a marketplace for the latest developments from the world of it security for electronic systems, distributed intelligence and the Internet of Things.
At our booth 4A-444 in hall 4A, we will present our latest IP module developments for automotive and a development platform for sensor-based IoT solutions.
Since the beginning of the 70ies Bosch is a major contributor to the automotive electronics industry. Our passion for electronics enabled many innovations which brought safety and comfort solutions on the road. Bosch holds more than 1,000 patents and patent applications related to MEMS technology.
Our products help to make trends such as connected vehicle, automated driving and electrification reality.
These technological achievements have also affected, even shaped the consumer electronics industry.
From February 23-25, embedded world Exhibition & Conference takes place at Messe Nuremberg, Germany. The Bosch booth will be located in Hall 4-444.
Let us inform you about our newest IP module developments for in-vehicle communication or powertrain applications. Also take a closer look on the brand-new XDK evaluation kit, a development platform for IoT solutions
Looking back we had a very exciting and successful year 2015:
Product highlights such as the new set of highly effective MEMS sensors SMI130, SMG130 and SMA130, which serve the rapidly growing field of vehicle comfort features, as well as the monolithic B6 bridge CJ260 were presented on numerous trade fairs and conferences all over the world.
Vehicle comfort functions like navigation, tilt or inclination measurement, telematics, car alarm, car key modules or eCall systems are a rapidly growing application field for MEMS sensors.
Typically, the required performance level for these sensors is lower compared to sensors for sophisticated safety applications like airbag or vehicle stability systems. In many comfort applications, consumer electronic (CE) sensors would be sufficient performance-wise, however they do not fulfil basic automotive requirements.
Our new set of cost attractive MEMS sensors now addresses this dilemma. Based on proven and reliable Bosch CE sensor products, these sensors have received additional features for being applied in the automotive world:
At present, Bosch offers three types of MEMS sensors for motion detection in comfort applications:
This set of sensors is planned to be gradually extended over the upcoming years.
In 2015, Bosch participates for the 3rd time at electronica India. The event will take place in New Delhi, Pragati Maidan exhibition centre from 9-11 September, 2015.
At our exhibition booth in Hall 7, B45, we will present our latest sensor and ICs products to the audience, especially to local manufacturers of automotive electronic control units.
This year’s hot topics at the booth:
Please meet us at our booth and explore the latest Bosch technology!
Bosch’s new SMA130 triaxial acceleration sensor provides information for infotainment and telematics applications in vehicles. The sensor measures ac-celeration along three axes arranged at right angles, as well as inclination, movement, vibration, and shock. It will go into series production in late 2015.
Bosch recently produced the five-billionth MEMS sensor at its plant in Reutlingen, Germany.
While it took 13 years to manufacture the first billion MEMS sensors, the Bosch Automotive Electronics division now manufactures the same quantity in less than one year at its production facility in Reutlingen, near Stuttgart. This is the result of skyrocketing demand.
More than four million sensors are currently manufactured every day. These little helpers have an average thickness of between just one and four millimeters.
If the five billion Bosch sensors were stacked on top of each other, the tower would be 12,000 kilometers tall; that is long enough to pass nearly all the way through the Earth, which has a diameter of 12,742 kilometers.
From February 24th to 26th, Bosch exhibits on embedded world 2015 in Nürnberg, Germany.
At our booth in hall 5 / 5-303, we will show you how beneficial and easy it is to:
See you in Nürnberg!
From January 14th to January 16th, Bosch will exhibit again on Car-Ele Japan in Tokyo.
At the Bosch booth in West Hall 1-63, we will present - along with other innovative Bosch solutions - our newest sensors, ICs and power modules for automotive applications.
We will demonstrate the new inertial combination sensor family for vehicle dynamics applications, the SMI7xx and fast in-vehicle communication using CAN FD.
From November 11th to November 14th, Bosch will exhibit again on electronica Europe in Munich, Germany.
At our exhibition booth in Hall 5 (A5.106), we will present our newest sensors, ICs and power modules for automotive applications.
In addition, we will demonstrate the new generation of inertial combination sensors for vehicle dynamics applications, the SMI7-series and fast in-vehicle communication using CAN FD.
Far infrared focal plane array for thermal imaging:
The SMO130 is a small uncooled far infrared sensor array designed for non-automotive applications like entry-level thermography cameras, surveillance cameras, monitoring systems for energy efficient building control or people counting systems.
Simplifying development of airbag systems
SMA6xy’s standardized housing makes design-in more straightforward
SMI7xy sensors for increased safety in vehicles
SMI7xy combines measurement of yaw rate and acceleration
Bosch exhibits at embedded world in Nuremberg, Germany from February 25 to 27, 2014
From February 27-27, Bosch Automotive Electronics exhibits at embedded world 2014 at Exhibition Centre Nuremberg.
Focus topics at our booth are the new CAN IP modules supporting CAN FD and our GTM Timer IP for powertrain applications.
Our booth is located in Hall 5 / 5-483.
On October 18 at The Westin Detroit Metropolitan Airport, Detroit, MI
Bosch and CiA organize jointly the CAN FD Tech Day on October 18th at the Westin Detroit Metropolitan Airport, Detroit, MI
The one-day event will provide first-hand information about the CAN FD protocol and its applications in automotive and other industries.