Please find the latest news for Bosch Semiconductors and Sensors below. For any questions, please use the contact form to contact us.
17/02/2012
MH6560C (600A IGBT halfbridge)
Updated Product information now available for download.
17/02/2012
MH6530C (300A IGBT halfbridge)
Updated Product information now available for download.
19/12/2011
Two billion Bosch MEMS sensors
Bosch sets a new production volume record: the technology company has manufactured two billion MEMS (micro-electro-mechanical systems) sensors since production began 16 years ago. Bosch is by far the world leader in the MEMS sensor market.
11/01/2012
CRC Requirements for CAN FD
New whitepaper detailing the CRC requirements for CAN FD now available for download.
19/12/2011
Bosch exhibits on Car-Ele Japan in Tokyo from Jan 18-20, 2012
From January 18-20, Bosch Automotive Electronics exhibits for the second time on Car-Ele Japan in Tokyo.
Our booth will be located in Tokyo Big Sight, East hall
19/12/2011
New Airbag Evaluation platform available from March 2012
25/11/2011
New Bosch SMP480 barometric pressure sensor is 75 percent smaller
The new Bosch SMP480 barometric pressure sensor takes up just one-quarter of the space of its predecessor. The sensor uses a 12-bit digital interface to provide pressure and temperature data, is packed in a ten-pin premold SMD housing and is RoHS-compliant.
26/10/2011
New SMP480 (Barometric pressure sensor for enginge management systems)
Product information now available for download.
26/10/2011
SMG074 (Angular rate sensor for Vehicle Dynamics Control)
Updated product information now available for download.
26/10/2011
SMG06x (Angular rate sensor for rollover applications)
Updated product information now available for download.
30/09/2011
CY325 (System Basis Chip)
Updated product information now available for download.
13/09/2011
CAN FD - CAN with higher and flexible data rate
New release of whitepaper with updated frame format now available for download.
Read our whitepaper for more information:
24/08/2011
New Airbag Evaluation Platform from Bosch Automotive Electronics and Freescale
Bosch Automotive Electronics' components division and Freescale Semiconductor have jointly created an Airbag Evaluation Platform, especially suited for the growing safety segment in emerging countries such as India and China. The Airbag Evaluation Platform demonstrates the operation of Bosch's current CG1xx Airbag ASSP family with a Freescale MPC560x MCU and works with sensors from both companies. The Airbag Evaluation Platform is available from first quarter 2012.
More details will follow shortly.
24/08/2011
New SMG10x-series rollover sensors – smaller, more robust, and continuously monitored
With an edge length of just 10.3 millimeters, the new SMG10x-series micromechanical rollover sensors are the smallest yaw-rate sensors Bosch has ever built for cars. Compared to the previous, second-generation sensors (SMG06x), this equates to a 65 percent saving in space required.
05/05/2011
SMA560 (Dual axis acceleration sensor, x/y): Updated product information now available for download
05/05/2011
SMB225 (Dual axis acceleration sensor, x/y): Product information now available for download
05/05/2011
SMB227 (Dual axis acceleration sensor, y/z): Product information now available for download
04/05/2011
M_CAN-IP: Updated versions of product information and user manual now available for download
04/05/2011
TT_CAN-IP (Time triggered CAN): Updated versions of product information and user manual now available for download
04/05/2011
CJ950 (18x Low-side power switch with MSC and SPI/parallel control): Updated product information now available for download
04/05/2011
New CJ950P (18x Low-side power switch with MSC control): Product information now available for download
02/05/2011
NEW: CAN FD - CAN with higher and flexible data rate
Read our whitepaper for more information:
02/05/2011
Bosch presents Power Mold Modules at PCIM in Hall 12, Booth 482
From Tuesday, May 17th to Thursday, May 19th, Robert Bosch GmbH will exhibit for the first time at PCIM 2011 in Nuremberg – Europe’s most important fair for power electronics.
At the booth, customers will get an overview on Bosch's continuously growing portfolio of innovative power semiconductor mold modules.
Download MH6560C product information 
